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Pb Free Plating Product
ISSUED DATE :2005/06/27 REVISED DATE :
GJ09N20
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
BVDSS RDS(ON) ID
200V 380m 8.6A
The GJ09N20 provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-252 package is universally preferred for all commercial-industrial surface mount applications at power dissipation levels to approximately 50 watts.
Description
Features
*Simple Drive Requirement *Lower On-resistance *Fast Switching Characteristic
Package Dimensions TO-252
REF. A B C D E F S
Millimeter Min. Max. 6.40 6.80 5.20 5.50 6.80 7.20 2.40 3.00 2.30 REF. 0.70 0.90 0.60 0.90
REF. G H J K L M R
Millimeter Min. Max. 0.50 0.70 2.20 2.40 0.45 0.55 0 0.15 0.90 1.50 5.40 5.80 0.80 1.20
Absolute Maximum Ratings
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS@10V Continuous Drain Current, VGS@10V Pulsed Drain Current
1
Symbol VDS VGS ID @TC=25 : ID @TC=100 : IDM PD @TC=25 :
2
Ratings 200 30 8.6 5.5 36 69 0.55 40 8.6 -55 ~ +150
Unit V V A A A W W/ : mJ A :
Total Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy Avalanche Current
Operating Junction and Storage Temperature Range
EAS IAR Tj, Tstg
Thermal Data
Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Symbol Rthj-c Rthj-a Value 1.8 110 Unit : /W : /W
GJ09N20
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ISSUED DATE :2005/06/27 REVISED DATE :
Electrical Characteristics (Tj = 25 : unless otherwise specified)
Parameter Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
Symbol BVDSS
BVDSS / Tj
Min. 200 2.0 -
Typ. 0.24 3.7 23 4 13 12 25 36 16 500 90 40
Max. 4.0 100 10 100 380 37 800 -
Unit V V/ : V S nA uA uA m
Test Conditions VGS=0, ID=1mA Reference to 25 : , ID=1mA VDS=VGS, ID=250uA VDS=10V, ID=5A VGS= 30V VDS=200V, VGS=0 VDS=160V, VGS=0 VGS=10V, ID=5A ID=8.6A VDS=160V VGS=10V VDD=100V ID=8.6A VGS=10V RG=10 RD=11.6 VGS=0V VDS=25V f=1.0MHz
Gate Threshold Voltage Forward Transconductance Gate-Source Leakage Current
Drain-Source Leakage Current(Tj=25 : ) Drain-Source Leakage Current(Tj=150 : )
VGS(th) gfs IGSS IDSS RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss
Static Drain-Source On-Resistance Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Change Turn-on Delay Time3 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
nC
ns
pF
Source-Drain Diode
Parameter Forward On Voltage3 Reverse Recovery Time Reverse Recovery Charge Symbol VSD Trr Qrr Min. Typ. 225 2260 Max. 1.3 Unit V ns nC Test Conditions IS=8.6A, VGS=0V IS=8.6A, VGS=0V dI/dt=100A/ s
Notes: 1. Pulse width limited by safe operating area. 2. Staring Tj=25 : , VDD=50V, L=1mH, RG=25 , IAS=8.6A. 3. Pulse width 300us, duty cycle 2%.
GJ09N20
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ISSUED DATE :2005/06/27 REVISED DATE :
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Normalized BVDSS v.s. Junction Temperature
Fig 4. Normalized On-Resistance v.s. Junction Temperature
Fig 5. Forward Characteristics of Reverse Diode
GJ09N20
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
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ISSUED DATE :2005/06/27 REVISED DATE :
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165
GJ09N20
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